ANRITSU Corporation is proud to announce verification and support of 3GPP RAN5 Rel-17 NR UDC testcases in collaboration with Qualcomm Technologies using the Qualcomm X105 5G Modem-RF.

Semiconductor chips have been evolving to meet the demands of rapidly transforming applications, and so has the test technology to meet the test goals of those chips. Going back two decades or so, the ...

The trend in semiconductors leads to more IC test data volume, longer test times, and higher test costs. Embedded deterministic test (EDT) has continued to deliver more compression, which has been ...

IC designers now have a powerful weapon in the struggle against rising test costs: commercially available EDA solutions that provide fast and effective means to implement scan compression on-chip. By ...